Technical Support, Research and Development

We have constantly active research and development together with our wide range partner network. We use our state-of-the-art laboratory equipment together with our customers’ needs to improve and develop our products. Our metallurgical and application know-how enable us to offer unique services for our partners.

We provide all the relevant metallurgical and destructive and
non-destructive tests; mechanical properties (tensile/yield strength, hardness, stress-strain curves), electrical conductivity, coating thickness, element analysis, grain size determination. And many many others...

In addition, we are equipped with newest high-technology machinery; including nanointender, laser scanning microscope and some high-quality confidential measuring devices. Our services include (but are not limited to) support in following highly sophisticated topics:

  • Material recommendation for existing and new technologies (including IMS, Thermal Diffusion Bonding,etc...)
  • High temperature brazing and bonding simulations for AMB and DCB
  • Alloy optimization for different applications
  • Flat and pin fin base plate optimization
  • Alternative solutions to avoid soldering cracks due to temperature changes
  • Alternative solutions to Al wire bonding
  • Elastic modulus (Youngs modulus) and Fracture Toughness
  • Measuring of copper characterizations from bonded/brazed copper-ceramic substrates
  • Berkovich tip
  • X-ray fluorescence spectroscopy (XRF)
  • Energy dispersive X-ray spectroscopy (EDX)
Contact
Helge Lehmann
Helge Lehmann

Head of Global Power Electronics

Phone +49 2402 1241 2124
Mobile +49 172 366 8423
Send e-mail
Juuso Järvinen
Juuso Järvinen

Manager of Global Power Electronics

Phone +358 44 726 7899
Send e-mail